May 8th -9th,International Meeting on Integrated Photonics 2017

QQ截图20170420190418

 International Meeting on Integrated Photonics 2017

 

 Abstract

 

In the future era of Big Data, Artificial Intelligence and Internet of Things, which will produce massive data, the traditional solutions based on microelectronic technique have encountered bottlenecks in development. The photonic integration technology with lower power consumption, larger bandwidth and higher transmission speed is well-known in the industry and has become the inevitable development trend of information technology. Such as several subversive technological revolution things: steam engine, electricity and information, photonic integration will lead the human into a new era of intelligent computing.

According to the technical and market maturity, photonic integration is in the early stages of the outbreak. The meeting is organized by the Shanghai International Micro-Tech Affiliation Center (SIMTAC) in collaboration with LioniX International,European Photonics Industry Consortium(EPIC),University Of Electronic Science And Technology Of China. In this meeting, global leaders from the whole value chain of photonic integration will meet and share their perspectives on the industry ’ s opportunities and challenges.

The meeting deliberations will focus on the challenges and opportunities of hybrid photonic integration.

As China is home to global leaders in telecommunications and also many important emerging companies active in integrated photonics, this international meeting will be an exciting opportunity for international organizations to meet and expand their presence in the Chinese market.

Photonic integration, the next generation of subversive technological revolution, has been ready. Global leaders from the whole industry chain is gearing up. We sincerely invite you to attend this meeting, gathering in Shanghai with industry and academic leaders.

 

Organizer

 

微信用

Shanghai International Micro-Tech Affiliation Center(SIMTAC)

 

Co-organizer

 

微信图片_20170322091907

LioniX International

http://www.lionix-international.com/

 

t0162e6b9bfea2b1288

University of Electronic Science and Technology of China

http://www.uestc.edu.cn/

 

logo

European Photonics Industry Consortium(EPIC)

 

Date and venue

 

Date: May 8th -9th, 2017

Venue: DoubleTree by Hilton Hotel Shanghai - Pudong(889 Yanggao Nan Road Pudong, Shanghai, 200127, China)

 

Agenda

 

International Meeting on Integrated Photonics 2017

 

May 8

Topic

Presenter

09:00-09:10

Welcome

09:10-09:40 Photonic integration today and tomorrow Prof. Dr. Meint Smit

Eindhoven University of Technology

09:40-10:10 Heterogeneously integrated

systems-on-chip for

next-generation communications

Dr. Tin Komljenovic

 John Bowers’ research group, University of California Santa Barbara

10:10-10:40 Photonic integration in developing Bandwidth Network

Mr. Li Zeng 

Huawei Technologies

10:40-11:10 SIMIT/SITRI Silicon photonics research and process technology platform
 

Dr. Mingbin Yu
SIMIT/SITRI

11:10-11:40

Coffee break

11:40-12:10 CMOS-embedded III-V on Silicon

laser sources

Dr. Gustavo Villares 

IBM-Zurich

12:10-12:40 Photonic Integration in China Prof. Tao Chu 

Zhejiang University

12:40-14:00

Lunch Break

14:00-14:30 Photonics in Korea  Mr. William Jang 

YMK Photonics

14:30-15:00 TriPleX: the low loss siliconnitride based photonic platform

for visible and IR applications

Prof. Dr. Rene Heideman 

LioniX International

15:00-15:30 InP and Polymer based Monolithicand Hybrid Integration

Prof. Dr. Martin Schell 

HHI Fraunhofer

15:30-16:00 InP foundry process for photonic integrated circuits Dr. Luc Augustin 

Smart Photonics

16:00-16:30

Coffee Break

16:30-17:00 

 

17:00-17:30

Mature silicon photonic platform towards multi-layer circuits  for very high integration level applications

 

Photonic Processing platform based on SOI at IMECAS

 Dr. Christophe Kopp 

CEA-Leti

 

Dr. Zhihua Li

Institute of Microelectronics of Chinese Academy of Science


17:00-18:00 Panel Discussion: Challenges and Potential of Hybrid Photonic Integration
18:00-19:00 Dinner and networking with the speakers (Registration Type: Basic +, limit of 50 people, optional on cost)

 

May 9

Topic

Presenter

09:00-09:25 Design software:Challenges and Solutions

Mr. Twan Korthorst 

PhoeniX Software

09:25-09:50 Latest trends in fablessphotonic integration and design

Dr. Iñigo Artundo 

VLC Photonics

09:50-10:15 Open access design services

Dr. Ronald Broeke 

Bright Photonics

10:15-10:30

Coffee break

10:30-10:55 High-Precision optical alignment&package for mass production Mr. Gaohong Shi 

Innolight

10:55-11:20 PIXAPP - Europe's Answer to the Global Challenge of Accessible & Scalable Photonic Packaging Dr. Lee Carroll 

Tyndall

11:20-11:45  Packaging of PhotonicIntegrated Circuits

Dr. Ronald Dekker 

LioniX International (XiO)

11:45-12:10 Hybrid Photonic Integrationand Packaging

Dr. Vannucci Antonello 

Cordon Electronics (formerly Linkra)

12:40-14:00

Lunch Break

13:00-16:30 Training on Photonic integration

(Registration type: Basic ++, optional on cost)

13:00-13:15 Introduction

13:15-14:00 Fabrication of Photonic chips Prof. Dr. Rene Heideman 

LioniX International

14:00-14:45 Introduction in Photonicintegration

 Dr. Iñigo Artundo 

VLC Photonics

14:45-15:00

Coffee Break

15:00-15:45 Designing for Photonic Chipsand Systems: Step by Step

Mr. Twan Korthorst 

PhoeniX Software

15:45-16:30 Challenges in integratedphotonic packaging

Dr. Lee Carroll 

Tyndall

 

16:30-18:00

Match making session, Exhibition and drinks

Registration Fee

Plan A: full conference registration
2500 RMB

 

Plan B: full conference registration+networking dinner
3100 RMB

 

Complimentary Plan:Half day training

Free

 

Notes: ≥4 persons can have a group discount. Please contact grace.wang@simtac.org for the details.

 
Registration fee includes Lunch Buffet during the conference(May 8,9) & Coffee Break.

 

Registration 

 

Please click the link to register :https://www.wenjuan.net/s/YfYjIfq/

 

Payment Method

 

Please transfer the full amount to the following account before May 1.And remark (Photonics + company name + name).

 

bank transfer

Company Name:Shanghai International Micro-Tech Affiliation Center

EURO Account Number:442971231707

USD Account Number:450771230879

Bene’s Bank: BANK OF CHINA,SHANGHAI BR,JIADING SUB-BR.

SWIFT CODE:BKCHCNBJ300

Address:NO 451 TACHENG ROAD,JIADING DISTRICT,SHANGHAI CHINA

 

alipay

Company Name:Shanghai International Micro-Tech Affiliation Center

Alipay Account:pay@simtac.org

 

If you have any questions, please contact: grace.wang@simtac.org
or Grace Wang +86 18516128250 
 

May 15-17th: Training on Integrated Photonics: technical follow-up with software hands-on sessions

Technical follow up in the form of software hands-on training on LioniX International TripleX(TM) Photonic PDK platform will be held at Tsinghua University on 15-17 May 2017. Tsinghua University is also going to present the study cases on the designs made by using the LioniX TripleX(TM) Photonic platform.

Software exercises on creating your own PDK in OptoDesigner will also be provided in this hands-on training. Demonstration on the other PDKs in OptoDesigner, such as the PDK for Heterogeneous SOI & III-V Photonics from UCSB will be presented also.

微信图片_20170329100752